1. Product Introduction of the high frequency electronic DIP PCBA
The high frequency electronic DIP PCBA comprises a copper clad laminate, an aluminum substrate, a base layer and a copper layer which are superposed from bottom to top in turn. Between the aluminum substrate and the copper clad laminate are provided with an adhesive layer for bonding and fixing the two and a positioning mechanism for positioning the two, and a heat dissipation silica gel layer is arranged on the lower surface of the copper clad laminate; The substrate layer comprises an epoxy resin plate and an insulating plate which are laminated and bonded with each other, the insulating plate is located on the upper surface of the aluminum substrate, and an adhesive layer is arranged between the aluminum substrate and the insulating plate to bond and fix them; the copper layer is located on the upper surface of the epoxy resin plate, and an etching circuit is arranged on the copper layer.
The high frequency electronic DIP PCBA uses the combination of aluminum substrate and copper clad laminate as the core of the circuit board. The positioning mechanism is used to fix the aluminum substrate and copper clad laminate, so as to improve the overall structural strength of the circuit board. By setting a heat dissipation silica gel layer on the lower surface of the copper clad laminate, the self heat dissipation efficiency of the circuit board can be effectively improved, and the working stability of the circuit board can be improved, Commonly used in automotive anti-collision systems, satellite systems, radio systems and other fields.
We use 3M600 OR 3M810 to check the first prototype and X-ray to inspect the the thickness of the coating.