Traditionally, through-hole devices are usually used. Their legs extend far enough to pass through holes in the PCB (printed circuit board). The device is placed on one side of the PCB and soldered on the other side.
Because through-hole components are simple, they are cheaper than surface mount devices. This is why most inexpensive electronic components use through-hole components.
DIP PCBA can be soldered in the plated through holes of the printed circuit board or inserted into the DIP socket.
DIP PCBA has the following characteristics:
(1) Suitable for perforation welding on PCB (printed circuit board), easy to operate.
(2) The ratio between the chip area and the package area is larger, so the volume is also larger.
(3) It is easier to wire the PCB than the TO type package.
(4) Easy to operate.
As already stated, DIP PCBA is relatively cheap, which helps reduce the total cost of the product. In addition, using it can also save other costs. For example, the assembly of through-hole components does not require any expensive equipment, such as a pick-and-place machine.
Application of DIP PCBA:
CPU 4004/8008/8086/8088, diode, capacitor resistance
The function of DIP PCBA:
The chip using this packaging method has two rows of pins, and these pins can be directly soldered on a chip socket with a DIP structure, or soldered in the same number of solder holes. Its characteristic is that it can easily realize the through-hole soldering of the printed circuit board and it has good compatibility with the main board.
The difference between placement machine and DIP:
Mounters usually install lead-free or short-lead surface mount components. The solder paste needs to be printed on the circuit board, and then installed by the chip mounter, and then the device is fixed by reflow soldering.
DIP soldering is a directly packaged device, which can be fixed by wave soldering or manual soldering.
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