1. Product introduction of Electronic Component Sourcing And SMT DIP Circuit Board Assembly
"PCB manufacturing - material procurement - PCBA processing" one-stop service mode, there are 8 SMT production lines, 3 wave soldering production lines, 3 assembly lines and auxiliary testing, aging supporting facilities, testing equipment and other facilities.
2. Product feature and application of Electronic Component Sourcing And SMT DIP Circuit Board Assembly
Dual In-Line Package (DIP) is an integrated circuit (IC) chip that is packaged IN a dual-in-line format. Most small and medium scale integrated circuits are packaged IN this format. The number of pins IN the PACKAGE is usually less than 100. The DIP packaged CPU chip has two rows of pins that need to be plugged into a DIP structure chip socket.
3. Product Qualification of electronic component sourcing And SMT DIP Circuit Board Assembly
Applicable to SMT BGA, CSP, Flip-Chip, IC semiconductor components, connectors, wires, photovoltaic modules, batteries, ceramics, and other electronic products internal penetration testing.