Aluminum PCB base circuit board is PCB subgrade board production called circuit board. Aluminum PCB  base copper clad plate is a kind of metal circuit board material, composed of copper foil, thermal insulation layer and metal substrate, its structure is divided into three layers: 

Line layer: equivalent to ordinary PCB copper clad plate, line copper foil thickness of 1oz to 10oz.

Insulation layer: Insulation layer is a layer of low thermal resistance thermal insulation material. Thickness: 0.003 "to 0.006" in. The core technology of aluminum based copper cladded panels is UL certified.

Substrate: a metal substrate, usually aluminum or optional copper. Aluminum base copper clad plate and traditional epoxy glass cloth laminate, etc

Aluminum PCB  substrate is composed of circuit layer, thermal insulation layer and metal base layer. The circuit layer (copper foil) is usually etched to form a printed circuit, so that the components are connected to each other. In general, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, the thickness of 35μm~280μm;

Thermal insulation layer is the core technology of PCB aluminum substrate, it is generally made of special polymer filled with special ceramics, small thermal resistance, excellent viscoelastic properties, thermal aging resistance, can withstand mechanical and thermal stress. Such technology is used in the thermal conductivity and insulation layer of high performance PCB aluminum substrate such as IMS-H01, IMS-H02 and LED-0601, which makes them have excellent thermal conductivity and high strength electrical insulation performance.

Metal base is the supporting member of aluminum substrate, which requires high thermal conductivity. Generally, aluminum plate or copper plate can also be used (copper plate can provide better thermal conductivity). It is suitable for drilling, punching, shearing and cutting and other conventional mechanical processing. Compared with other materials, PCB material has incomparable advantages. Suitable for power module surface mount SMT assembly. No radiator, greatly reduced volume, excellent heat dissipation effect, good insulation and mechanical properties.