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SMT Processing And Testing Equipment Have Which, Have What Use


Nowadays, people's lives are increasingly inseparable from electronic products, which also makes China's electronic industry in a state of continuous growth, the rapid development of integrated circuit industry. The demand for pcb circuit boards is only increasing, the market demand is large, circuit board manufacturers are also emerging endlessly...

The SMT processing process is complex and tedious. Each link may have problems. In order to ensure the quality of products, it is necessary to use all kinds of testing equipment for fault defect detection, timely solve the problem. So what are the common testing equipment in SMT processing?  What is its function?

SMT testing equipment

1. MVI(manual visual inspection)

2. AOI testing equipment

(1) The use of AOI testing equipment: AOI can be used in a number of positions on the production line. Each position can detect special defects, but the AOI inspection equipment should be placed in a position where the most defects can be identified and corrected as soon as possible.

(2) Defects that can be detected by AOI: AOI is generally detected after the etching process of PCB board, which is mainly used to find the missing part and the excess part.

3. X-RAY detector

(1) The use of X-RAY detector: can detect all solder joints on the circuit board, including the naked eye can not see the solder joints, such as BGA.

(2) X-RAY detector can detect the defects: X-RAY detector can detect the main defects after welding bridge, hole, solder joint is too large, solder joint is too small and other defects.

4. ICT testing equipment

(1) Application of ICT: ICT is oriented to production process control and can measure resistance, capacitance, inductance, and integrated circuit. It is especially effective for detecting open circuit, short circuit, component damage, accurate fault location, convenient maintenance.

(2) Defects that can be detected by ICT: defects such as virtual welding, open circuit, short circuit, component failure, and wrong materials after welding can be tested.