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PCBA Patch Processing Quality Control


PCBA production process in PCB manufacturing, PCBA incoming electronic components procurement and inspection, SMT processing, plug-in processing, fire, aging test, and a series of processes, supply chain and manufacturing chain is longer, the problem of any link can cause PCBA board of batch quality closes nevertheless, and cause adverse consequences. In this case, the quality control of PCBA patch processing is a very important quality assurance in electronic processing, so what is the main quality control of PCBA processing?

It is particularly important to hold a prenatal meeting after receiving orders for PCBA processing. It mainly analyzes the process of PCB Gerber documents and submits the manufactured report (DFM) according to different customer needs. Many small manufacturers do not pay attention to this, but often prefer it. It is not only easy to produce poor quality problems caused by poor PCB design, but also a lot of rework and repair work.

PCBA incoming electronic components procurement and inspection

We need to strictly control the procurement channels of electronic components and must take goods from large traders and original manufacturers, so as to avoid the use of second-hand materials and counterfeit materials. In addition, it is necessary to set up a special PCBA incoming material inspection post to strictly check the following items to ensure that the parts are fault-free.

PCB: Check the temperature test of reflow welding furnace, whether the hole without flying wire is blocked or ink leakage, whether the board surface is bent, etc.

IC: Check whether the screen printing is identical with the BOM, and keep it under constant temperature and humidity.

Other common materials: Check screen printing, appearance, power measurement, etc.

SMT assembly

Solder paste printing and reflux furnace temperature control system are the key points of the assembly, which requires the use of laser steel mesh with higher quality requirements and better ability to meet the processing needs. According to the requirements of pcb, some need to add or reduce steel mesh, or u-shaped hole, just make steel mesh according to the process requirements. The temperature control of the reflow furnace is essential for the wetting of the solder paste and the welding of the steel mesh, which can be adjusted according to the normal sop operating guidelines.

In addition, strict implementation of AOI test can greatly reduce the adverse effects caused by human factors.

Plug-in processing

In the process of plug-in, the mold design for over wave welding is the key. PE engineers must continue to practice and summarize the process of how to use molds to maximize the yield of good products.

PCBA machining plate test

For orders with PCBA test demand, the main test contents include ICT (circuit test), FCT (function test), burn test (aging test), temperature and humidity test, drop test, etc.